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deepl10 Deepl50001 DeepL Cookie deepl DeepL DeepL DeepL ChatGPTDeepL DeepL DeepL DeepLDeepL DeepLOmegaTOmegaTDeepL 22 avr. 2024 PC DeepL22.9945.99/ DeepL Pro 22 mars 2025 , - 52pojie.cn In the unexposed regions of the resist film, the DNQ acts as a dissolution inhibitor and the resist remains

insoluble in the aqueous base developer. In the exposed regions, the DNQ forms a ketene, which, in turn, reacts with ambient water to form a base soluble indene carboxylic acid. Viscosity affects the flow characteristics and film thickness, and depends on the solid content and temperature. Adhesion describes how strongly the film sticks to a broad range of substrate materials like silicon, oxide, nitride, polysilicon, and metals. Incomplete adhesion can cause a severe distortion or even the loss of a pattern. The ultimate goal in designing a DNQ-novolac resist is to design a material that displays a strongly non-linear response in dissolution rate versus exposure and provides good film forming Apr 1, 2002 On exposure of an inhibited novolak film the DNQ moiety of the PAC undergoes a photoreaction (the Wolff rearrangement) which is highly exothermic. A temperature spike is generated in the vicinity of the reacting DNQ and that severs the hydrogen bond between the string and its sulfone anchor. Using a sufficiently transparent resin, a suited photon energy (g-, h-, i-line with respect to the specific DNQ) and a sufficient H2O-concentration in the resist, the quantum efficiency in DNQ-based positive-tone photoresists achieves values of typically 20-30 %. Positive-Tone Photoresists based on Dissolution Inhibition by Diazonaphthoquinones. The intrinsic limitations of bis-azidecycHzed mbber resist systems led the semiconductor industry to shift to a class of imaging materials based on diazonaphthoquinone (DNQ) photosensitizers. This DNQ photoresist is widely used in semiconductor, MEMS and thin film head for passivation, stress buffer layer and permanent insulation layer that require high cross linking and low thermal expansion properties.